
The thermal conductivity of copper based materials is twice that of aluminum based materials, and the higher the thermal conductivity, the better the thermal conductivity and heat dissipation performance.
2. Copper based materials can be processed into metalized holes, while aluminum based materials cannot. The network of metalized holes must be the same, which makes the signal have good grounding performance. Secondly, copper itself has weldability, making it possible to choose welding for the final installation of the designed structural components.
3. The copper base of the copper substrate can be etched into fine patterns and processed into a convex shape. Components can be directly attached to the convex surface to achieve excellent grounding and heat dissipation effects.
4. However, the price of copper substrates is also much higher than that of ordinary circuit boards, so many customers want to replace them with ordinary boards. Today, what I want to say is that it is absolutely not possible.